Celsia Announces First Vapor Chamber Heat Sink for Memory Modules, Developed for

Tag: Heat Sink Profile

Celsia Technologies  (BULLETIN BOARD: CSAT), a leader in cooling solutions for the PC, telecommunications infrastructure, and LED lighting industries, announces that Mushkin will be cooling its latest high performance Ascent Redline and Ascent XP memory modules using eVCI (enhanced Vapor Chamber Interface) heat sinks by Celsia.

"Our new Ascent line represents the pinnacle of memory technology, so we wanted the thermal solution to be equally as cutting edge," said George Stathakis, President of Mushkin, Inc.  "As far as we know, this is the first time memory has been cooled using vapor chambers.  As a result, memory modules have been tested to remain up to 21 degrees C cooler using eVCI technology than comparable modules without a heat sink*. Moreover, the thin, low profile design of all Ascent products gives enthusiasts the ability to fill all memory slots."

For the Mushkin eVCI cooling solution Celsia used its patented NanoSpreader technology, a copper encased two-phase vapor chamber into which pure water is vacuum sealed. The liquid is absorbed by a copper wick and passed as vapor through a micro-perforated copper sheet where it cools and returns as liquid to the wick. NanoSpreader vapor chambers can be made thinner and wider than heat pipes and can be attached directly to the heat source, increasing thermal performance of high heat flux cooling solutions by as much as 30% over solutions using heat pipes.