Mitsui Mining & Smelting Develops High Capacitance Embedded ...

Tag : capacitor

Mitsui Mining & Smelting Co Ltd has announced the developmentof AEC-1, an embedded capacitor material with capacitance densityas high as 1µF/cm 2 that enables ICs to operate at much higher frequencies. SinceAEC-1 is easily patterned using conventional PCB process, not onlywill IC packages utilize the material but many other applicationswill find it advantageous as well.
The capacitor has very high capacitance density, which isapproximately 500 times larger than existing commercially availablecapacitor material. Testing has demonstrated that the materialsurvives under severe environments of high temperature and highhumidity without degrading it functioning as a capacitor.Therefore, it provides for the stable functioning of ICs, andcontributes to the integration of next-generation mobile devices.
The thin profile of the capacitor allows it to embed in themultilayer board, which lower total cost in manufacturing byreducing surface mounting cost, board area and simplifyingmanufacturing process. In particular, by embedding right under theICs, AEC-1 provides sufficient current without generating noisebecause of the extremely short distance (low inductance).
AEC-1 was developed by harmonizing and utilizing the technologiesfrom other business units of the company such as electrodepositedcopper foil, conventional embedding capacitor material (FaradFlex),inorganic material and physical vapor deposition. This is a complexmaterial said to have excellent adhesion strength between metal andmetal oxide ceramics. The ceramic dielectric layer (0.6µmthick) is sandwiched between copper electrode (2-20µm thick)and Nickel electrode (20-50µm thick).
The ceramic dielectric layer consists of environmentally safematerials, and contains no lead. The structure of AEC-1 allows itbe patterned on both sides using standard etching processes. Thecompany aims to begin commercialization of AEC-1 within the nextfew years by developing partnerships with manufacturers in severalapplication areas.