Aries Electronics\' New Test and Burn-In and RF Sockets Now ...

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BRISTOL, Pa., Sept. 5 /PRNewswire/ -- Aries Electronics, aninternational manufacturer of standard, programmed and custominterconnection products, has recently updated its CSP/BGA test andburn-in and RF sockets, including 13 mm squared, 27 mm squared, 40mm squared and 55 mm squared models, to accommodate devices withpitches down to 0.3 mm. With this new pitch capability, Aries'sockets are suitable for use with an even greater range of CSP,MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices. In addition,Aries' standard molded socket format enables each socket toaccommodate any device package size indicated by using machined orcustom molded pressure pads or interposers.
Aries' new RF test sockets can be easily mounted to and removedfrom the printed circuit board (PCB), and the CSP/BGA test andburn-in sockets can be conveniently mounted to and removed from theburn-in-board (BIB). The ease of mount and removal is made possibleby the sockets' solderless pressure mount compression springprobes, which can be accurately located by two molded plasticalignment pins and mounted with four stainless steel screws.
Aries' new sockets offer gold over nickel plated compression springprobes, which enable the spring probes to leave very small witnessmarks on the bottom surface of the device solder balls. Thepressure pad compression spring also provides proper force againstthe device, allowing for height variations in device thickness.
Also included with the CSP/BGA test and burn-in version is afour-point spring probe crown to insure "scrub" on solderball oxides. The RF socket includes "scrub" on solderballs with raised tip probes that provide "scrub" onpads. Signal path during test is 0.077" [1.96mm].
The sockets accommodate up to 500,000 cycles and operate attemperatures of -55 degrees Celsius to 150 degrees Celsius (-67degrees Fahrenheit to 302 degrees Fahrenheit). Both versions arecomprised of spring probes with contact forces of 15 g per contacton 0.30 mm to 0.35 mm pitches, 16 g per contact on 0.40 mm to 0.45mm pitches, 25 g per contact on 0.50 mm pitches or larger. Springprobes are heat-treated beryllium copper alloy plated with 30micron" min. (0.75 micron) gold per Mil-G-45204 over 30micron" min. (0.75 µm) nickel per SAE-AMS-QQ-N-290. Thesockets' molded components are UL94V-0 Ultem and machinedcomponents are UL94V-0 PEEK or Torlon. All hardware is stainlesssteel.
As with all Aries sockets, the new CSP/BGA test and burn-in and RFsocket versions are available in custom materials, platings, sizesand configurations to suit specific customer applications.
Pricing for a 100 lead device socket starts at $150.00. Delivery is20 working days ARO.
For additional information, contact Aries Electronics Inc., 2609Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax:215-781-9845; Email: Email Contact ;
Europe Email: Email Contact .
For additional news releases from Aries Electronics, please visit http://www.simongroup.com/PressRoom/aries.html
Web site: http://www.arieselec.com/

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