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Engis launches micro lapping/polishing machine

http://www.manufacturingtalk.com/news/eng/eng164.h [2008-7-21]

Tag : Automatic Polishing Machine

The machine can be operated in unmanned mode, either 'timed' or'thickness controlled', while still maintaining its accuracy and repeatability .
This small machine has a generous component envelope of 55mmdiameter, with 18mm maximum thickness, making it capable ofproducing a wide range of precision components.

The small scale of the lapping surface gives a significant benefitin enabling the machine to lap and polish ultra-thin pieces thatwould be impossible on larger dual face machines.

Easy accessibility is provided by a manual lift-off top plate,simplifying the removal of components and minimising componentbreakage, contamination of the working zone and the subsequent needfor cleaning down or pad replacement.

Engis UK managing director, John Wellings, said: "Our knowledge ofthe industry led us to realise that there was a real need for amachine of this size and capability as it satisfies a range ofdifferent user needs, in addition to volume production of smallcomponents, it can also be used to manufacture short runs which arenot economically viable on large double sided machines, but toodemanding to produce on single sided machines, as well as themanufacture of pre-production components".

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