Transcend Introduces aXeRam DDR3-1800

Tag : 4 Layer PCB


Taipei, Taiwan -- Transcend Information Inc. unveils aXeRam DDR3-1800+ ExtremePerformance memory. Designed specifically for hard-core gamersusing only top-binned, premium quality DRAM chips and customhigh-purity aluminum heat sinks with cooling fins, the aXeRamDDR3-1800 dual-channel kit delivers amazing high-speed overclockingperformance while maintaining cool temperatures and rock-solidsystem stability.

Transcend's 2GB aXeRam DDR3-1800 kit's two identically-matched240-pin unbuffered 1GB DDR3 1800MHz DIMMs are carefully matched foruse in dual-channel configuration, which together provide memorybandwidth of up to 28.8GB/s. To ensure extra-stability and signalintegrity at high clock speeds, all aXeRam modules use robusteight-layer PCBs that fully comply with JEDEC standards. The aXeRam128Mx8 DDR3 DRAM chips are selected with the strictest quality andperformance standards and are manufactured using small Fine-PitchBall Grid Array (FBGA) packages to assure better thermaldissipation, electrical efficiency and improved overclockingperformance.

Transcend's aXeRam DDR3-1800 modules also support new Intel ExtremeMemory Profile (XMP) technology, which allows users withhigh-performance motherboards to easily overclock their memory withaXerRam's built-in aggressive speed-maximized profiles, or manuallyinput their own memory timing parameters to take their system tothe next level.

Transcend memory modules are built to exacting specifications withthe finest chips and materials available, and they undergostrenuous laboratory testing to ensure the best performancepossible. Recognized worldwide for their reliable high quality,outstanding performance, excellent compatibility and stableoperation, Transcend memory modules are the obvious choice ofdiscerning power users.