Motion System Helps Shatter Semiconductor Packaging Speed Records
http://www.designworldonline.com/ArticleDetails.as [2008-7-10]
Tag : IC Tray
by Design World Staff
Monday, June 09, 2008
The Systemation inspection system uses motion control from BoschRexroth. The distributed, scalable architecture is built around thehigh-speed FireWire backbone to support up to 20 axes of controlper machine.
The semiconductor industry has an urgent need for speed. Driven byintense cost and competitive pressures, semiconductor producers aretrying to maximize the number of products they produce whileimproving outgoing quality.
A critical point is the final step: inspection and packaging. Thefaster the finished integrated circuits are inspected and moved outthe door, the faster the plant achieves return on investment.
Systemation Semiconductor of New Berlin, WI manufactures inspectionand packaging equipment for the semiconductor and electronicsindustries. Recently, the company launched an integrated circuit(IC) inspection and packaging machine under its Systemation®brand. This machine beats the industry benchmark throughputproduction rate for handling a specific number of units per hour(UPH) by 5000, thanks to a robust motion control system from BoschRexroth Hoffman Estates, IL.
Smaller and faster
The cost for a next-generation semiconductor assembly and testfacility is staggering. About the only way to achieve a return oninvestment, especially in such a highly competitive environment, isto maximize throughput, as measured in units per hour and do itwith equipment that takes up the smallest work area possible.
The newest machine form Systemation responds to these needs. TheST-868 Handling System features AVS DefectZero
by Design World Staff
Monday, June 09, 2008
The Systemation inspection system uses motion control from BoschRexroth. The distributed, scalable architecture is built around thehigh-speed FireWire backbone to support up to 20 axes of controlper machine.
The semiconductor industry has an urgent need for speed. Driven byintense cost and competitive pressures, semiconductor producers aretrying to maximize the number of products they produce whileimproving outgoing quality.
A critical point is the final step: inspection and packaging. Thefaster the finished integrated circuits are inspected and moved outthe door, the faster the plant achieves return on investment.
Systemation Semiconductor of New Berlin, WI manufactures inspectionand packaging equipment for the semiconductor and electronicsindustries. Recently, the company launched an integrated circuit(IC) inspection and packaging machine under its Systemation®brand. This machine beats the industry benchmark throughputproduction rate for handling a specific number of units per hour(UPH) by 5000, thanks to a robust motion control system from BoschRexroth Hoffman Estates, IL.
Smaller and faster
The cost for a next-generation semiconductor assembly and testfacility is staggering. About the only way to achieve a return oninvestment, especially in such a highly competitive environment, isto maximize throughput, as measured in units per hour and do itwith equipment that takes up the smallest work area possible.
The newest machine form Systemation responds to these needs. TheST-868 Handling System features AVS DefectZero
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